Wafer Level Capping Technology Rights

Wafer Level Capping Technology Rights. Means all trade secrets, know-how, technical information, methods, processes, procedures and inventions, whether patentable or otherwise, and all intellectual property rights embodied therein or based thereon, that are owned and possessed by Analog as of the date of this Agreement or developed or created by Analog within two years after the Effective Date which relate to the wafer level capping and chip-level packaging technology described on Exhibit C attached hereto.